• Photos
  • Assembly Name
  • Type
  • Manufacturer
  • Marking
  • Layers
  • Thickness
  • Area
  • Core Material
  • Substrate Technology
  • Min Trace Pitch
  • Min Trace Width
  • Thru Via Land Diameter
  • Thru Via Hole Diameter
  • Blind Via Land Diameter
  • Blind Via Hole Diameter
  • Device
  • Mainboard to Docking Board Flex
  • FPC
  • No login/license to access
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  • Pressure Sensor Flex
  • FPC
  • No login/license to access
  • 查看授权
  • Laser Focus Flex
  • FPC
  • No login/license to access
  • 查看授权
  • USB Type-C Flex
  • FPC
  • No login/license to access
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  • Card Slot Flex
  • FPC
  • No login/license to access
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  • Mainboard to Docking Board Flex
  • FPC
  • No login/license to access
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  • Docking Board to Spring Board Flex
  • FPC
  • No login/license to access
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  • Fingerprint Sensor Flex
  • FPC
  • No login/license to access
  • 查看授权

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