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  Part Number Manufacturer Package Type IO Description Package Marking Size(mm*mm) Cost(¥) Device BOM
QM75001 QORVO MCP 24 RF Fusion Module QM7 5001 Z1R8 4.00*3.00 0.30 Mi 8
QM52015 QORVO MCP 12 RF Power Amplifier Module 52015 25XJ 3.50*3.00 0.30 Mi 8
DIE Part Number DIE Manufacturer DIE Description DIE Marking DIE Size Quantity
  QM52015 QORVO RF Power Amplifier Module 2016 QORVO 1.00*0.50 1
QM78013 QORVO MCP 46 High Band RF Fusion Module QORVO QM78013 F702JQU 7.70*5.50 1.56 Mi 8
SDR845 Qualcomm BGA 253 RF Transceiver QUALCOMM SDR845 101 FC811V76 6.40*6.10 4.00 Mi 8
QM78012 QORVO SIP 38 High Band RF Fusion Module QORVO QM78012 F702BY1 7.20*5.50 1.56 Mi 8
CYW43438KUBG Cypress WLP 63 Single-Chip IEEE 802.11ac b/g/n MAC/Baseband/Radio with Integrated Bluetooth 4.1 and FM Receiver CYW43438 KUBG 1737 EF 25 CYP 639539 TWN 33-99 4.90*2.90 4.80 Amazfit Sports Smart Watch 2(A1609)
N / A WLP 49 GPS D5603 750 A15J 3.00*3.00 1.30 Amazfit Sports Smart Watch 2(A1609)
MT6625LN Media Tek 40 Wi-Fi,Bluetooth,GPS,FM MEDIA TEK MT6625LN 1735-AJCNL BAP14740 ACMQP8J0 5.00*5.00 3.00 Amazon Echo (2nd Generation)
SW5077 Silicon Works QFN 28 Mobile DDI/TDDI SIW SW5077 G603010F 1714 5.00*4.00 0.60 Surface Pro(1796)
DIE Part Number DIE Manufacturer DIE Description DIE Marking DIE Size Quantity
  SW5077 Silicon Works Mobile DDI/TDDI SW5068 01 66665 3.50*1.50 1
  SW5077 Silicon Works Mobile DDI/TDDI 690SMS S599900 2.80*0.80 1
CSD87334Q3D TI QFN 12 Synchronous Buck NexFET™ Power Block 87334D TI 75I C7RR 3.30*3.30 0.09 Surface Pro(1796)
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