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  •  
  • Part Number
  • Manufacturer
  • Package Type
  • IO
  • Description
  • Package Marking
  • Size(mm*mm)
  • Cost(¥)
  • Qty
  • Device BOM
  • SM8150
  • Qualcomm
  • BGA
  • 894
  • Snapdragon 855 8-Core Application and Baseband Processor
  • QUALCOMM SM8150 103-AB
  • 12.40*12.40
  • 70.00
  • 1
  • Galaxy S10+(SM-9750)
  • SDM8150
  • Qualcomm
  • BGA
  • Snapdragon 855 8-Core Application and Baseband
  • 14.00*14.00
  • 70.00
  • 1
  • Unsorted
  • SDM450
  • Qualcomm
  • BGA
  • Baseband Processor, Octa-core 8x1.8GHz
  • QUALCOMM SDM450 B01-AA JU8302KD
  • 14.00*12.00
  • 22.00
  • 1
  • Galaxy A6+(SM-A605G-DS)
  • SDM845
  • Qualcomm
  • BGA
  • 914
  • Snapdragon 845 8-Core Application and Baseband Processor
  • QUALCOMM SDM845 F02-AA JC838F78
  • 12.40*12.40
  • 57.00
  • 1
  • MIX 3(M1810E5E)
  • SDM450
  • Qualcomm
  • BGA
  • Snapdragon 450 8-Core ARM Cortex A53 Application and Baseband
  • QUALCOMM SDM450 B01-AA JE833MF9
  • 14.00*11.90
  • 17.00
  • 1
  • realme2(RMX1805)
  • MT6771V
  • Media Tek
  • BGA
  • Helio P60 4xCortex-A53+4xCortex-A73 64-bit Application Processor
  • MEDIA TEK ARM MT6771V 1816-ZAMAH CTPHTR16
  • 11.80*11.00
  • 7.60
  • 1
  • realme1(CPH1859)
  • Hi3680
  • Hisilicon
  • BGA
  • Kirin 980 8-Core ARM Application Processor and Baseband Processor
  • Hisilicon HI3680 GFCV130 YD1861840 1843-TW 15
  • 14.00*14.00
  • 60.00
  • 1
  • Honor Magic2(TNY-AL00)
  •  
  • Part Number
  • Manufacturer
  • Package Type
  • IO
  • Description
  • Package Marking
  • Size(mm*mm)
  • Cost(¥)
  • Qty
  • Device BOM
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