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  Part Number Manufacturer Package Type IO Description Package Marking Size(mm*mm) Cost(¥) Device BOM
MT8163V Media Tek BGA 64-bit quad-core ARM Cortex-A53 MPCore, 3D graphics (OpenGL ES 3.1), 13-megapixel camera ISP, DDR3/L up to 800MHz and high-definition 1080p video decode MEDIA TEK ARM MT8163V 1731-KBCTH CCMK439E 12.70*12.00 6.70 amazon - Amazon Echo (2nd Generation)
器件信息..
MSM8998 Qualcomm BGA POP-2 Chips Qualcomm Snapdragon 835 8-Core Application and Baseband Processor QUALCOMM MSM8998 302 AB JC807RSQ 12.80*11.90 55.00 Nubia - Red Magic(NX609J)
Hi3670 Hisilicon BGA 0 Kirin 970 8-Core ARM(4xCortexA73 2.4Ghz+4xCortexA53 1.8Ghz) Application Processor and Baseband Processor 14.10*14.10 25.00 HUAWEI - Mate 10 Pro
SDM660AIE Qualcomm BGA 984 Baseband Processor, Octa-core (4x2.2 GHz Kryo 260 & 4x1.8 GHz Kryo 260), Adreno 512 GPU, 14nm FinFET process QUALCOMM SDM660 301-AA 660AIE JE744TB7 12.00*12.00 25.42 Xiaomi - Mi 6X
SDM660 Qualcomm BGA 984 Baseband Processor, Octa-core (4x2.2 GHz Kryo 260 & 4x1.8 GHz Kryo 260), Adreno 512 GPU, 14nm FinFET process QUALCOMM SDM660 301 AA 660 AIE JE745V7M 12.10*12.10 25.42 Vivo - X21 UD
SDM660 Qualcomm BGA 984 Baseband Processor, Octa-core (4x2.2 GHz Kryo 260 & 4x1.8 GHz Kryo 260), Adreno 512 GPU, 14nm FinFET process QUALCOMM SDM660 101-AA 660 AIE JE742P06 12.00*12.00 25.42 Oppo - R15 Dream Mirror Edition
SDM630 Qualcomm BGA 984 Qualcomm Snapdragon630 Octa-core (4x2.2 GHz Kryo 260 & 4x1.8 GHz Kryo 260), Adreno 508 GPU, 14nm FinFET process and Baseband Processor QUALCOMM SDM630 100-AA JK745HPH 12.00*12.00 0.00 Sony - Xperia XA2 Ultra H4233
SDM845 Qualcomm BGA 914 Snapdragon 845 8-Core Application and Baseband Processor B02 JX751CVH 12.70*12.00 57.00 Samsung - Galaxy S9+ (SM-9650&DS)
器件信息..
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