Vivo - X9s Plus

012 -NXP
TFA9890A
9.5 V boosted audio system with adaptive sound maximizer and speaker protection
011 -Qualcomm
PM8004
Power Management
010 -Samsung
KLMCG2KETM
eMMC 5.1 512Gb Flash
007 -Qualcomm
MSM8976SG
PoP- Chip 2: 4*Cortex A72 1.95GHz + 4*Cortex A53 1.4GHz Application Processor and Baseband Processor
006 -Samsung
K3QF4F40BMFGCF
PoP- Chip 1: 32Gb SDRAM
004 -ESS
ES9318
Audio Chip with Hi-Fi
003 -Rockchip
RK1608
Pre-ISP
002 -Qualcomm
WTR2965
RF Transceiver Support 4G/3G Built-in GPS/GLONASS/Beidou/Galileo
001 -STMicroelectronics
LSM6DS3
6-Axis (Gyroscope+Accelerometer)
017 -Qualcomm
PM8956
Power Management
032 -Qualcomm
PMI8952
Power Management
030 -Skyworks
SKY13492-21
0.7 To 2.7 GHz SP16T MIPI Antenna Switch Module
029 -Skyworks
SKY77824-11
Power Amplifier Module For FDD LTE Bands 7 And 30, TDD LTE Bands 38/41 And 40, And AXGP Band
027 -Skyworks
SKY77648-11
Multimode Multiband Power Amplifier Module for Quad-Band GSM/Edge
024 -Qualcomm
WTR2965
RF Transceiver Support 4G/3G Built-in GPS/GLONASS/Beidou/Galileo
020 -RFMD
RF1117
Antenna Switch
019 -Skyworks
SKY19237-001
0.7 to 2.7 GHz Triple SPST (3xSPST)Shunt MIPI Switch
016 -Qualcomm
WCN3680B
Wi-Fi,Bluetooth,FM Radio
015 -N/A
RF Switch
014 -Skyworks
SKY85709-11
5 GHz 802.11ac WLAN Front-End Module
Part Info
Part Number
Type PCB
Marking ET1009AM OA IEB HT2 LG4.A.V
Assembly Name Mainboaed
Core Material
Substrate Technology
Layers Count 10
BlindViaLand Diameter
BlindViaHole Diameter
ThruViaLand Diameter
ThruViaHole Diameter
Area
Min Trace Pitch
Min Trace Width
Thickness 0.70
Manufacturer
沪ICP备13021560号-1
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