Xiaomi - Mi6

SIM
015 -N/A
Hall
014 -Qualcomm
SMB1381
Quick Charge 3.0 Battery Charger
013 -Qualcomm
PMI8998
Power Management
012 -Qualcomm
WCD9335
Audio Codec
011 -Samsung
KLUCG4J1ED-B0C1
64GB ROM
010 -Qualcomm
MSM8998
8-Core Application Processor and Baseband Processor
009 -Samsung
K3UH6H6
6GB RAM
008 -Qualcomm
QET4100
Envelope Tracker
007 -Qualcomm
PM8005
Power Management
005 -NXP
PN80T
NFC Controller
003 -InvenSense
ICM-20690
6-axis Gyroscope and Accelerometer
002 -Bosch
BMP280
Barometric Sensor
001 -AKM
AK09916C
3-axis Electronic Compass
033 -Knowles
SPA2629LR5H-B?
Noise-Cancelling Microphone
029 -RFMD
RF1500
Antenna Switch
028 -Avago
ACPM-7800
Multiband Multimode PA Quad-Band GSM/EDGE and Multi Mode B1, B2/25, B3, B4, B34/39, B5/26, B8, B20, B28A, B28B
027 -Skyworks
SKY77824-11
Power Amplifier Module for FDD LTE Bands 7 and 30, TDD LTE Bands 38/41 and 40, and AXGP Band
026 -N/A
RF Module
025 -Qualcomm
WTR5975
RF transceiver
024 -N/A
RF Module
023 -N/A
RF Module
022 -N/A
RF Module
021 -N/A
RF Module
020 -Qualcomm
PM8998
Power Management
019 -NXP
TFA9888
High-efficiency Stereo Class-D Audio Amplifier
018 -Qualcomm
WCN3990
Wi-Fi,Bluetooth,FM Radio
017 -QORVO
QM48858
RF Fusion Antenna Share iFEM Module
016 -QORVO
QM48858
RF Fusion Antenna Share iFEM Module
Part Info
Part Number
Type PCB
Marking 3501C01M00A
Assembly Name Mainboard
Core Material
Substrate Technology
Layers Count
BlindViaLand Diameter
BlindViaHole Diameter
ThruViaLand Diameter
ThruViaHole Diameter
Area
Min Trace Pitch
Min Trace Width
Thickness 0.60
Manufacturer UMT
沪ICP备13021560号-1
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