Xiaomi-Mi 5C

014 -TI
LM3697
High-Efficiency Three-String White LED Driver
013 -NXP
TFA9891
Smart Audio Amplifier
012 -TI
TPS65132
Single Inductor - Dual Output Power Supply
011 -Pinecone
SPM100
PMIC?
010 -TI
BQ25898C
I2C Controlled Single Cell 3A Charger for High Input Voltage
009 -Toshiba
THGBMHG9C4LBAIR
eMMC-64GB NAND Flash
008 -TI
LM3648TT
Synchronous Boost LED Flash Driver with 1.5-A High-Side Current Source
007 -Pinecone
S1
Octa Core Processor, up to 2.2GHz
006 -Elpida
FP164A3PD-JD-F
PoP-1 Chip 24G-bit SDRAM
005 -Realtek
ALC5659
Audio Circuits
004 -Bosch
BMI160
6-Axis (Gyroscope+Accelerometer)
003 -N/A
ALS/Proximity Sensor
001 -N/A
Microphone
031 -TI
BQ27426
System-Side Impedance Track Fuel Gauge
024 -Skyworks
SKY77912
Tx-Rx Front-End Module for Quad-Band GSM / GPRS / EDGE w/ 10 Linear TRx Switch Ports, Dual-Band TD-SCDMA, and TDD LTE Band 39
023 -Skyworks
SKY77645-11
SkyLiTE Multimode Multiband Power Amplifier Module Applications
021 -ACP(Advanced Circuit Pursuit)
ACPE4GE31C1
RF Transceiver
020 -TI
BQ25890
5A Fast Charger MaxCharge Technology for High Input Voltage and Adjustable USB OTG Boost
019 -Broadcom
BCM47531A1
Integrated Monolithic GPS、GLONASS、BeiDou and QZSS Receiver IC
018 -TI
LP8758-E0
Four-Output Synchronous Step-Down DC-DC Converter
017 -TI
TS3USB3000
DPDT USB 2.0 High-Speed and Mobile High-Definition Link (MHL) 6.1-GHz Switch
016 -Broadcom
BCM43455XKUBG
5G WiFi/BT
Part Info
Part Number
Type PCB
Marking
Assembly Name Mainboard
Core Material
Substrate Technology
Layers Count
BlindViaLand Diameter
BlindViaHole Diameter
ThruViaLand Diameter
ThruViaHole Diameter
Area
Min Trace Pitch
Min Trace Width
Thickness .7
Manufacturer COMPEQ
沪ICP备13021560号-1
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